This is the third of the three tutorial articles devoted to the frequency-domain analysis of a lossless transmission line.
2.5D/3D integration is an Integrated Circuit (IC) packaging technique that allows the combination of dies of the same or different technologies in the same IC package.
Even if you are not involved in the practice of the measurement of antennas but have a passing interest and would like to learn more, this is the standard to read. Doing so will quickly get you up to speed, saving you many hours of unnecessary research and much confusion.
LISN- Line Impedance Stabilization Networks, AN- Artificial Networks, and ISN- Impedance Stabilization Networks all refer to the same device. The difference between the terms is different standards choose to us... Read More...
The growing application of lithium-ion batteries brings with it an increased risk of unanticipated energy releases and thermal runaway. Quantifying battery energy release characteristics during product design can help mitigate those risks.
As the name suggests, 6G is the sixth generation of mobile connectivity technology. The IEEE Standards Association is building an ecosystem of interested stakeholders from across the globe to address the need for robust, responsible, and affordable wired/wireless platforms in the future.
This article discusses two recent European Commission publications: a proposal for an EU Sustainable Products Regulation and the 2022-2024 Ecodesign & Energy Labelling Working Plan. Both publications raise implications for businesses involved in the manufacture and supply of electrical and electronic equipment to the EU market.
Part 2 of this article summarizes the results of recent testing conducted by the author on the shielding effectiveness of screened cables up to 2.8 GHz.
Implementing a process of EMC compliance for a specific project is much more than simply ensuring that the design engineers follow a long list of “do’s and don’ts” in the form of EMC design rules. Following this process will reap benefits when EMC performance is evaluated at the end of the design process.