ESD Challenges in 2.5D/3D Integration

2.5D/3D integration is an Integrated Circuit (IC) packaging technique that allows the combination of dies of the same or different technologies in the same IC package.

Banana Skins – March 2023 (#417-421)

417.  Mains harmonic distortion from electronic equipment upsets energy providers  The increasing use of electronic equipment is causing ‘harmonic distortion’ on the UK supply network. This is caused by non-li... Read More...

IEEE Recommended Practice for Antenna Measurements

Even if you are not involved in the practice of the measurement of antennas but have a passing interest and would like to learn more, this is the standard to read. Doing so will quickly get you up to speed, saving you many hours of unnecessary research and much confusion.

Energy Release Quantification for Li-Ion Battery Failures

The growing application of lithium-ion batteries brings with it an increased risk of unanticipated energy releases and thermal runaway. Quantifying battery energy release characteristics during product design can help mitigate those risks.

The 6G Future: How 6G Will Transform Our Lives

As the name suggests, 6G is the sixth generation of mobile connectivity technology. The IEEE Standards Association is building an ecosystem of interested stakeholders from across the globe to address the need for robust, responsible, and affordable wired/wireless platforms in the future.

Latest EU Ecodesign and Energy Labeling Developments

This article discusses two recent European Commission publications: a proposal for an EU Sustainable Products Regulation and the 2022-2024 Ecodesign & Energy Labelling Working Plan. Both publications raise implications for businesses involved in the manufacture and supply of electrical and electronic equipment to the EU market.

EMC Management in Charging Applications

Implementing a process of EMC compliance for a specific project is much more than simply ensuring that the design engineers follow a long list of “do’s and don’ts” in the form of EMC design rules. Following this process will reap benefits when EMC performance is evaluated at the end of the design process.