June 2016

A 1988 study of current distribution in printed circuit boards reveals how return‑current paths, ground‑plane impedance, and trace coupling drive EMI and signal‑integrity issues. Its insights on low‑impedance ground structures remain foundational for today’s high‑speed digital designs.

Although the foundation of a failure analysis is rooted in science, there is also an art to completing one, successfully. The path from “problem discovery” to “problem solution” has many bumps and twists along the way and this article will hopefully help guide you on your journey.

Semiconductor manufacturing puts special demands on the electromagnetic environment at the factory.

International regulations addressing radiofrequency identification (RFID) devices may seem as endless and evolving as applications for the technology itself.

Today’s fast-paced, high-growth electronics market requires electromagnetic compliance (EMC) test facilities to develop shorter product test cycles while maintaining test accuracy.

Take time to check for EMI, efficiency, temperature, safety, immunity, or any other requirement in your product.

For the purposes of safety, what is “working voltage,” and what is its relevance to the safety of the equipment?