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IEC Releases New Edition of IEC/TS 61967-3 Test Procedure

Integrated Circuits | In Compliance Magazine

A new edition of the test procedure, IEC/TS 61967-3, has been released by the International Electrotechnical Commission. IEC/TS 61967-3 ed 2.0 applies to “Integrated circuits – Measurement of electromagnetic emissions – Part 3: Measurement of radiated emissions – Surface scan method.” The new edition is available for purchase on the IEC website.

Description*

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Why Capacitance? Benefits & Applications of Digital Capacitive Solutions

In this paper, readers will discover digital capacitive displacement measurement solutions not possible with conventional analog systems. The following applications address a wide range of industry sectors.

IEC TS 61967-3:2014 provides a test procedure which defines an evaluation method for the near electric, magnetic or electromagnetic field components at or near the surface of an integrated circuit (IC). This diagnostic procedure is intended for IC architectural analysis such as floor planning and power distribution optimization. This test procedure is applicable to measurements on an IC mounted on any circuit board that is accessible to the scanning probe. In some cases it is useful to scan not only the IC but also its environment. For comparison of surface scan emissions between different ICs, the standardized test board defined in IEC 61967-1 should be used. This measurement method provides a mapping of the electric or magnetic near-field emissions over the IC. The resolution of the measurement is determined by the capability of the measurement probe and the precision of the probe-positioning system. This method is intended for use up to 6 GHz. Extending the upper limit of frequency is possible with existing probe technology but is beyond the scope of this specification. Measurements may be carried out in the frequency domain or in the time domain.”

*Description from IEC Website

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