IEC 61190-1-3 Published for Attachment Materials for Electronic Assembly

The International Electrotechnical Commission (IEC) has released IEC 61190-1-3:2017. This third edition of Part 1-3 pertains to attachment materials for electronic assembly, specifically the requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications.


“IEC 61190-1-3:2017 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for “special” electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453. This document is a quality control document and is not intended to relate directly to the material’s performance in the manufacturing process.

This edition includes the following significant technical changes with respect to the previous edition:

a)   The maximum impurity level of Pb has been revised and the table of lead free solder alloys includes some additional lead free solder alloys.”

*Description from the IEC Website 

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