A new edition of IEC 61190-1-2 has been published by the International Electrotechnical Committee. IEC 61190-1-2 applies to “Attachment materials for electronic assembly – Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly.” The new edition is available for purchase on the IEC website.
“IEC 61190-1-2:2014-02(en-fr) specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material’s performance in the manufacturing process.”
*Description from IEC website