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High Temperature Soldering Study

paperKEMET, leading global supplier of electronic components, released its study supporting transient liquid phase sintering (TLPS) materials as an alternative for high temperature lead-based solders.

KEMET Electronics and Ormet Circuits, Inc. completed a multi-year study focused on the characterization of high temperature multilayer ceramic capacitors using TLPS materials. The objective was to develop a ceramic capacitor component that was both RoHS compliant and had robust reliability in harsh, high temperature operating environments.

The results of the study were presented in a keynote address at the Material and Science Technology Conference held in Columbus, Ohio earlier this month. The presentation can be downloaded on KEMET’s Engineering Center. The full publication may also be purchased through Springerlink for a small fee.

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“KEMET customers want robust products that can thrive in today’s high operating temperatures,” said Dr. John Bultitude, KEMET Vice President and Technical Fellow. “Ormet was a natural choice for this study because its TLPS materials are uniquely positioned as a green technology with enabling electrical properties.”

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