Tin/lead solder terminations are necessary for processes where reflow soldering is the component assembly method. In such situations, gold terminations require additional processing to pre-tin the terminations prior to assembly in order to prevent gold embrittlement. The tin/lead terminated QPL inductors now available from Gowanda provide an effective time-saving, solder-friendly solution.
The MLRF0603 and MLRF0805 series are designed for RF applications in military, aerospace and defense communities. This includes use in communication, guidance and security applications, as well as in radar, test & evaluation and special mission applications. These series can also be used in other high frequency applications around the world where the rigorous testing associated with these QPL-approved inductors makes them desirable for high reliability (hi rel) designs, or wherever QPL-approval provides additional assurance of performance and reliability.
Gold terminations are available as well as tin/lead solder terminations. The Sn/Pb solder-coated termination meets Termination Finish Code B and Code F of the MIL-PRF-83446 mil spec. The Au termination meets Code A. Operating temperature for each series is -55°C to +125°C.
Gowanda Electronics’ proprietary epoxy capping technique provides uniform dimensional stability for pick-and-place assembly and assures environmental and mechanical protection of the coil.
Gowanda Electronics can offer variations to these designs in order to meet the specific requirements of a particular application. The pursuit of QPL approval for such customer-specific designs depends on volume and other factors. Additionally Gowanda can upscreen a standard design from a commercial product line using the company’s in-house environmental testing lab to fulfill customer reliability requirements. Gowanda will also consider inquiries from companies looking for partnering opportunities to address specific QPL needs.
To learn more visit www.gowanda.com.
