Fujipoly announced the expansion of its Sarcon® XR-Pe product offering with the availability of a 1.0 mm thick sheet. Sarcon® XR-Pe delivers a remarkable thermal conductivity of 11 W/m°K (ASTM D 5470) with a thermal resistance as low as .06°Cin2/W.
The silicone-based material easily conforms to most CPU and semiconductor shapes with a very low compression force requirement. This soft-touch characteristic is maintained for applications that require material compression from 30% up to 90%. Additionally, Sarcon® XR-Pe can be used in applications with temperatures ranging from -40 to +150°C.
This advanced material helps improve semiconductor performance by efficiently transferring unwanted heat to a nearby heat sink. Sarcon XR-Pe is now available in 1.0, 1.5 and 1.5mm thick sheets up to a maximum dimension of 300mm x 200mm. This material can also be ordered in die-cut form to fit your custom application specifications.
For more information, visit www.fujipoly.com.
