Fujipoly Introduces Easy Handling Thermal Compound

SARCON® SPG-30A from Fujipoly is an ideal thermal interface option for circuit boards with a large surface area, many components and delicate solder points. The form-in-place silicone compound completely fills all spaces, gaps and protrusions when compressed by a heat sink or spreader. The material’s high viscosity and ultra-low compression force are ideal for applications with gaps ranging from .30mm to 1.0mm.   

Once applied, SARCON® SPG-30A delivers a thermal conductivity of 3.2 W/m°K with a thermal resistance of only .3°Cin2/W. The form stable thermal compound requires no heat curing, will not cause corrosion on metal surfaces, and maintains all initial properties across a wide temperature range (-40C to + 150C). Fujipoly’s SARCON® SPG-30A material is available in 30ml tubes, 325ml cartridges. 

For more information, visit www.fujipoly.com