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Fujipoly Introduces Easy Handling Thermal Compound

SARCON® SPG-30A from Fujipoly is an ideal thermal interface option for circuit boards with a large surface area, many components and delicate solder points. The form-in-place silicone compound completely fills all spaces, gaps and protrusions when compressed by a heat sink or spreader. The material’s high viscosity and ultra-low compression force are ideal for applications with gaps ranging from .30mm to 1.0mm.   

Once applied, SARCON® SPG-30A delivers a thermal conductivity of 3.2 W/m°K with a thermal resistance of only .3°Cin2/W. The form stable thermal compound requires no heat curing, will not cause corrosion on metal surfaces, and maintains all initial properties across a wide temperature range (-40C to + 150C). Fujipoly’s SARCON® SPG-30A material is available in 30ml tubes, 325ml cartridges. 

For more information, visit www.fujipoly.com

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A Dash of Maxwell’s: A Maxwell’s Equations Primer – Part Two

Maxwell’s Equations are eloquently simple yet excruciatingly complex. Their first statement by James Clerk Maxwell in 1864 heralded the beginning of the age of radio and, one could argue, the age of modern electronics.

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