Get our free email newsletter

Fuijpoly America’s Form-in-Place Thermal Compound Sets New Industry Benchmark

Fujipoly’s new SARCON SPG-50A sets a new performance standard for form-in-place gap filler materials by delivering a thermal conductivity of 5.0 W/m°K. In addition, the new silicone-based compound exhibits ultra-low compression force making it ideal for applications that have delicate components or low compression requirements.

The form stable SPG-50A material fills large gaps around fragile circuit board solder points without causing damage or loss in performance and efficiently transfers heat from any board-level source to a nearby heat sink or heat spreader. Fujipoly’s newest thermal compound will not cause corrosion on metal surfaces, and maintains all initial properties across a wide temperature range (-40C to + 150C). SARCON® SPG-50A is available in easy-to-use tubes or syringes. 

For more information, call (732) 969-0100 or visit us on the Web at http://www.fujipoly.com.

- Partner Content -

A Dash of Maxwell’s: A Maxwell’s Equations Primer – Part Two

Maxwell’s Equations are eloquently simple yet excruciatingly complex. Their first statement by James Clerk Maxwell in 1864 heralded the beginning of the age of radio and, one could argue, the age of modern electronics.

Related Articles

Digital Sponsors

Become a Sponsor

Discover new products, review technical whitepapers, read the latest compliance news, trending engineering news, and weekly recall alerts.

Get our email updates

What's New

- From Our Sponsors -

Sign up for the In Compliance Email Newsletter

Discover new products, review technical whitepapers, read the latest compliance news, trending engineering news, and weekly recall alerts.