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Fuijpoly America’s Form-in-Place Thermal Compound Sets New Industry Benchmark

Fujipoly’s new SARCON SPG-50A sets a new performance standard for form-in-place gap filler materials by delivering a thermal conductivity of 5.0 W/m°K. In addition, the new silicone-based compound exhibits ultra-low compression force making it ideal for applications that have delicate components or low compression requirements.

The form stable SPG-50A material fills large gaps around fragile circuit board solder points without causing damage or loss in performance and efficiently transfers heat from any board-level source to a nearby heat sink or heat spreader. Fujipoly’s newest thermal compound will not cause corrosion on metal surfaces, and maintains all initial properties across a wide temperature range (-40C to + 150C). SARCON® SPG-50A is available in easy-to-use tubes or syringes. 

For more information, call (732) 969-0100 or visit us on the Web at http://www.fujipoly.com.

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Shielding Effectiveness Test Guide

Just as interference testing requires RF enclosures, isolation systems in turn need their own testing. This document reviews some of the issues and considerations in testing RF enclosures.

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