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Signal Integrity Challenges in High Speed Interconnects and Power Integrity – Key Fundamental and Advanced Topics

13may1:00 pm2:30 pmSignal Integrity Challenges in High Speed Interconnects and Power Integrity – Key Fundamental and Advanced Topics1:00 pm - 2:30 pm(GMT-04:00) Event Type Webinar

Event Details

Join us for an interactive session on Signal Integrity/Power Integrity. The session starts with short presentations by industry experts, followed by an extended Q&A session moderated by EMC Society President, Alistair Duffy.

Presentation Title:

Signal Integrity Challenges in High Speed Interconnects

 

Speaker: Xiaoning Ye, Principal Engineer, Intel Corporation

 

Abstract: This talk will discuss some major signal integrity challenges in high speed interconnects. The data rates of high-speed interconnects have grown exponentially over the last two decades to meet the ever-increasing performance requirements in computer systems. The electrical performance of printed-circuit-boards (PCBs) and related interconnects are now becoming crucial for high speed interconnect design. Industry is facing these challenges; we will discuss some of the latest developments to address them.

 

Panel Discussion: Dr. Ye will provide an overview on Signal Integrity challenges and discuss solutions available to meet these challenges. As part of the panel discussion, attendees are welcome to ask questions on the non-ideal effects in PCB interconnects impacting electrical performance, such as loss, crosstalk, impedance discontinuity, etc. at high frequencies (10s GHz and above); test methods and fixtures needed to keep up with the highly-demanding accuracy requirements without compromising measurement results; and the latest work in the newly created IEEE P370 standard in development.

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Time

May 13, 2020 1:00 pm - 2:30 pm(GMT-05:00)

Location

Remote

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