Mechanical Design for EMC

This two-day course on 19 and 22 June for mechanical engineers provides clear applications, theory and demonstrations for the successful design of mechanical enclosures for good system emissions and immunity performance. Key topics include grounding at the PCB and enclosure, system ground maps, PCB component placement and control drawings, enclosure and cable shielding, PCB device “cans”, resonant slots and enclosures, heat sinks, unintentional antennas, as well as connector, screw, and conductive gasket placement.

This two-day course is Day 1 and 4 of a 4-day programme from 19 – 22 June. It can be taken on its own or with one or both of the following courses:

• Applying Practical EMI Design and Troubleshooting Techniques (Day 2 – 20 June)
• Advanced Printed Circuit Board Design for EMI & Signal Integrity (Day 3 – 21 June)