Advanced Printed Circuit Board Design for EMC + SI
Event Details
This two-day course on 19 and 21 June provides a unique blend of theory, applications, and numerous hardware demonstrations to describe effective PCB design strategies to eliminate
Event Details
This two-day course on 19 and 21 June provides a unique blend of theory, applications, and numerous hardware demonstrations to describe effective PCB design strategies to eliminate EMC problems such as radiated emissions & immunity, and ESD, and to improve low and high frequency signal integrity of analog and digital sensors.
The real-time hardware demonstrations use a spectrum analyzer, oscilloscope and signal generators to illustrate inductance, common-impedance coupling, and ground loops in PCBs, cables, and systems. Specific examples of single-point, multi-point, “good”, and “bad” grounds will be discussed. We will also apply the course learning by discussing and examining actual SILENT client case histories as well as examples of integrated circuit application notes.
This two-day course is Day 1 and 3 of a 4-day programme from 19 – 22 June. It can be taken on its own or with one or both of the following courses:
- Applying Practical EMI Design and Troubleshooting Techniques (Day 2 – 20 June)
- Mechanical Design for EMC (Day 4 – 22 June)
more
Time
June 19, 2018 - June 21, 2018 (All Day) UTC/GMT(GMT-05:00)
Location
University of Oxford