Photofabrication Engineering (PEI) has expanded its manufacturing capabilities for custom-designed, photochemically-etched surface-mount and insert-mount lead frames for integrated circuit manufacturing. These lead frames are used in a wide variety of applications including semiconductors, glass-to-metal seals, and relays, as well as medical applications such as hearing aids.
Using base materials such as kovar, nickel-iron alloys, copper alloys, and pure nickel, PEI can plate lead frames in their entirety or selectively. Lead-free plating materials include silver, nickel, gold, or tin, depending on the customer’s specific electrical and thermal conductivity requirements. Since the lead frame is the main conduit by which heat flows from the chip to the printed circuit board, PEI selects the manufacturing material to maximize the device’s operating life for any given application or environment.
PEI manufactures high-density lead frames with acute profiles and ultra-fine pitches, allowing for high pin counts. Single- or double-sided lead frames are etched without incurring the stresses associated with typical machining methods. More importantly, PEI’s process can be used for lead frames that are too complicated for stamping. Dimensions can be held to extremely tight tolerances, with no burrs or other surface irregularities.
PEI’s lead frames range in thickness from 0.5 mil [0.0127 mm] to 40 mil [1.575 mm], with features as small as 4 mil [0.10 mm] on 0.010 in. [0.254 mm] centers, creating lead frames that are strong enough to be handled yet flexible enough to allow bending when necessary.
For more information about PEI’s lead frames and other photoetched products, visit http://www.photofabrication.com.
