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CST of America, Inc. – find us at Booth 409

CST will be presenting the latest developments of CST STUDIO SUITE® at booth #409
 
EMC and EMI issues can arise from structures and components at every scale, from aircraft and vehicle bodies down to cables and even individual seams. To simulate scenarios such as emissions or lightning strikes accurately, it can be necessary to include all these structures in the 3D simulation. However, the difference in scale between, for example, the length of a cable harness and the width of an individual conductor, or the size of an enclosure and the thickness of its seams, can make these models challenging to solve.
The TLM solver in CST MICROWAVE STUDIO® lets complex structures be represented with accurate compact models, and enables bi-directional transient co-simulation with CST CABLE STUDIO® (CST CS). The electromagnetic behavior of complex cables and cable harnesses can be modeled in a 3D environment using computationally-efficient models in CST CS, with the ability to model real shields and twisting of wires among other factors. With bi-directional simulation, it’s possible to calculate the complex couplings that arise when fields absorbed by a cable in one part of the device are conducted and re-radiated in another part.

Visit booth #409 and learn more about the latest techniques for cable co-simulation and modeling across a range of scales.

 

 

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