Cree, Inc. has introduced the industry’s first commercially available silicon carbide (SiC) six-pack power module in an industry standard 45mm package. When replacing a silicon module with equivalent ratings, Cree’s six-pack module can reduce power losses by 75 percent, which leads to an immediate 70 percent reduction in the size of the heat sink or a 50 percent increase in power density. The new six-pack SiC module unlocks the traditional design constraints associated with power density, efficiency and cost, thereby enabling the designer to create high performance, reliable and low cost power conversion systems. When compared to state-of-the-art silicon modules, the SiC 1.2 kV, 50A modules deliver performance equivalent to silicon modules rated at 150A.
The CCS050M12CM2 six-pack modules from Cree are available for immediate shipping through Digi-Key Corporation and Mouser Electronics. Gate driver ICs suitable for SiC MOSFETs are available from IXYS and Texas Instruments.
Complete gate driver boards (CRD-001) are available as samples from Cree upon request. For further information about the new Cree® SiC six-pack module, visit www.cree.com/SiC-modules.