One of most common ways to remove this performance-hindering byproduct is to use a heat sink. To maximize cooling performance, Fujipoly® offers a full line of extremely soft, Sarcon® GR-ae thermal interface materials. These gap filler pads dramatically increase surface area contact between the component and heat sink.
The cost-effective silicone based material is available in nine thicknesses that deliver a thermal conductivity of 1.3 W/m°K with a thermal resistance as low as 0.50 °C cm2/W. Sarcon® GR-ae is available in pre-cut sheets up to 200mm x 300mm or can be die-cut to fit your exact application specifications.