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Kai Esmark

Kai has more than 20 years experience in the field of ESD and EOS. He is Senior Principal for “Overvoltage Robust Design” in the Automotive business group of Infineon in Munich (Germany). In his role, he takes care of the development of robustness concepts against electrically related threatening scenarios on IC- as well as on system-level. He also acts as a consultant at Infineon regarding EOS (better: EIPD) related field returns supporting root cause finding. Kai contributes to the development of standard practice documents in the Automotive Industry dealing with semiconductor devices showing a signature of electrical overstress. These activities are in close cooperation with USCAR (United States Council for Automotive Research) and VDA (German Association of the Automotive Industry). At the same time, he is serving the ESDA as an instructor by giving tutorials about EOS and the use of TCAD tools for ESD development purposes at the annual EOS/ESD Symposium.

From This Author

Addressing an Industry Concern: The Demand for a CDM Bare Die Testing Method

Traditional Charged Device Model testing falls short for bare dies in 2.5D/3D devices. With discharge currents reaching 500 mA at just 5V, existing methods can't handle the unique challenges of testing unpackaged components. CCTLP emerges as a promising alternative for reliable low-voltage testing.

Voltage to Current Correlation for CDM Testing

It is now well known that testing for CDM ESD evaluation is becoming a bigger challenge. An alternate approach called capacitively coupled transmission line pulsing (CCTLP) offers advantages over standard field-induced CDM testing.

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