James Davis

James Davis received a B.S. degree in electrical engineering from Brigham Young University (Provo, Utah USA) in 2002. He has been involved with on-chip ESD protection at Micron Technology, Inc. (Boise, Idaho USA) for the past twenty years. He is currently part of the R&D group focusing on on-chip ESD protection and design for NAND flash products. Mr. Davis is currently a Senior Member Technical Staff ESD/Latchup engineer.

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The Impact on ESD Risk of AI on Silicon Fabrication and the Implications of Increasing Memory Stacks

This column explores the significant impact of artificial intelligence on advancements in silicon fabrication, focusing on the development of high bandwidth memory (HBM) and associated die-to-die(D2D) electrostatic discharge (ESD) protection challenges.

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James Davis

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