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EOS/ESD Association, Inc.

Founded in 1982, EOS/ESD Association, Inc. is a not for profit, professional organization, dedicated to education and furthering the technology Electrostatic Discharge (ESD) control and prevention. EOS/ESD Association, Inc. sponsors educational programs, develops ESD control and measurement standards, holds international technical symposiums, workshops, tutorials, and foster the exchange of technical information among its members and others.

From This Author

Low Voltage Charged Device Model (CDM) Testing at a Crossroads

Most ESD experts consider CDM testing to be the most critical ESD qualification test for modern integrated circuits. ESD control engineers need to know the charged device ESD robustness of all components passing through their manufacturing line. CDM measurements provide that knowledge.

Indium-gallium-zinc-oxide (IGZO) Thin-film-transistors (TFT) and ESD

The thin-film transistor (TFT) became commercially available slightly more than 30 years ago in the form of a switch for the Liquid Crystal Display.

Characterization for ESD Design, the TLP Zoo: Part 2

This is the second of a two-part series on transmission line pulse (TLP) testing.

Characterization for ESD Design, the TLP Zoo: Part 1

Author’s Note: This is the first of a two-part series on the TLP Zoo,...

What Are External Latch-up and Internal Latch-up?

Overall, latch-up prevention is one of the most important tasks for both foundries and IC designers. Based on the chip design scheme, designers should select proper solutions to eliminate the ILU and ELU risks in chip design, referencing the foundry guidelines and latch-up silicon data to ensure minimal latch-up risks for the product. 
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Use of HBM and CDM Layout Simulation Tools

The methodology of the state of the art of HBM and CDM layout simulations tools is described. Two real-life case studies are presented briefly and the outlook towards future developments is discussed.

Understanding Footwear and Flooring in ESD Control

If you really want to know whether your footwear and flooring are working together, measure the resistance from the wearer via footwear and flooring to earth (ground).

What Are the Advantages of Capacitively Coupled TLP (CC-TLP)?

Within the past 18 years, many studies exploring 3 µm to 7 nm technologies have demonstrated the excellent correlation of CC-TLP with CDM in terms of stress current failure threshold as well as electrical failure and physical damage signature.

Automated Latch-Up Verification in 2.5D/3D ICs

In today’s tightly packed layouts, most integrated circuits (ICs) end up with parasitic bipolar transistors (pnp and npn) somewhere.

Next to FinFET, How Will ESD Suffer?

Several new transistor architectures have been proposed to achieve more powerful computing capability. In this article, we will look at the impacts of these transistor architectures on ESD reliability.
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