This article provides a high-level overview of the Industry Council paper “Survey on Latch‑up Testing Practices and Recommendations for Improvements,” which describes the full analysis of the collected responses and lays a path for potential adaptations needed to accommodate its use in future technologies and applications.
There is often confusion about the interaction between IC-level component ESD protection and the appropriately required system-level ESD protection strategy.
This article introduces typical latch-up verification techniques to detect and prevent latch-up. These techniques rely on electronic design automation (EDA) tools to deliver the coverage necessary to identify and eliminate latch-up risks.
When handling ESD-sensitive components, we must protect them from ESD damage.
Most ESD experts consider CDM testing to be the most critical ESD qualification test for modern integrated circuits. ESD control engineers need to know the charged device ESD robustness of all components passing through their manufacturing line. CDM measurements provide that knowledge.
The thin-film transistor (TFT) became commercially available slightly more than 30 years ago in the form of a switch for the Liquid Crystal Display.
This is the second of a two-part series on transmission line pulse (TLP) testing.
Author’s Note: This is the first of a two-part series on the TLP Zoo, the variety of transmission line pulse (TLP) systems used in the characterization of electrical components and system of ESD robustness. In ... Read More...
Overall, latch-up prevention is one of the most important tasks for both foundries and IC designers. Based on the chip design scheme, designers should select proper solutions to eliminate the ILU and ELU risks in chip design, referencing the foundry guidelines and latch-up silicon data to ensure minimal latch-up risks for the product.
The methodology of the state of the art of HBM and CDM layout simulations tools is described. Two real-life case studies are presented briefly and the outlook towards future developments is discussed.