Chris Long

Christopher Long has over 30 years of experience as a senior engineer for IBM Research in semiconductor development and manufacturing, focusing on fab ESD/ESA/contamination control program management, yield learning/modeling, and leading-edge MRAM/SRAM memory design enablement. Mr. Long has published numerous papers on fab ESD/ESA controls, yield improvement, and MRAM design development. He served as U.S. chair of the International Technology Roadmap for Semiconductors (ITRS) Yield Enhancement technology working group, responsible for the development of the Yield Enhancement chapters of the 2001 and 2003 ITRS. Mr. Long received a B.S. in Physics from Beloit College, Beloit, WI (1980), and an M.S. in Engineering from the Thayer School of Engineering, Dartmouth College (1990), Hanover, NH.

From This Author

The Need for a Dedicated ESD Control Document in a Semiconductor Fabrication Environment

Applying back end ESD standards straight into the fab often misses the mark, overcontrolling low risk areas while leaving reticle handling, ionization imbalance, and isolated conductors exposed. Here's why semiconductor fabs need their own ESD guidance document, and how it should work alongside ANSI/ESD S20.20.

Digital Sponsors

Become a Sponsor

Discover new products, review technical whitepapers, read the latest compliance news, and check out trending engineering news.

Get our email updates

What's New

- From Our Sponsors -