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Heinrich Wolf

Heinrich Wolf received his diploma degree in electrical engineering from the Technical University of Munich (TUM) and his Ph.D. from the Technical University of Berlin, Germany. He joined the chair of integrated circuits at TUM as a member of the scientific staff working on electrostatic discharge-related issues. This involved modeling of ESD-protection elements, parameter extraction techniques, and test chip design. In 1999, he joined the Munich branch of the Fraunhofer Institute for Reliability and Microintegration (IZM) which became the Fraunhofer Institution for Microsystems and Solid State Technologies EMFT in 2010. He was involved in the investigation of ESD protections for CMOS and smart power technologies. Furthermore, he worked on the simulation and development of ESD protections and on the devel¬opment of ESD test methods and tester characterization. He is also coordinating the ESD-related activities at the EMFT including the development of ESD test systems and the design of protection structures for deep submicron technologies. Furthermore, he works in the field of RF simulation and characterization in the frequency range up to 110 GHz. Currently, he also represents the German ESD-Forum in the standards working groups.

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What Are the Advantages of Capacitively Coupled TLP (CC-TLP)?

Within the past 18 years, many studies exploring 3 µm to 7 nm technologies have demonstrated the excellent correlation of CC-TLP with CDM in terms of stress current failure threshold as well as electrical failure and physical damage signature.

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