Marko Simicic

Marko Simicic received his B.Sc. and M.Sc. in electrical engineering and information technology from the University of Zagreb, Croatia, in 2010 and 2012 respectively. He obtained a Ph.D. degree from the department of electrical engineering ESAT, KU Leuven, Belgium in 2018. In 2017 he joined the ESD team at imec, Belgium, with the focus on researching ESD solutions for devices and circuits. He has authored or co-authored more than 35 papers in international journals and conference proceedings and is an active member of the JS-002 ANSI/ESDA/JEDEC joint standard for CDM ESD device sensitivity testing.

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ESD Challenges in 2.5D/3D Integration

2.5D/3D integration is an Integrated Circuit (IC) packaging technique that allows the combination of dies of the same or different technologies in the same IC package.

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Indium-gallium-zinc-oxide (IGZO) Thin-film-transistors (TFT) and ESD

The thin-film transistor (TFT) became commercially available slightly more than 30 years ago in the form of a switch for the Liquid Crystal Display.

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