Get our free email newsletter

Mirko Scholz

Dr. Mirko Scholz received his Ph.D. in Electrical Engineering from the Vrije Universiteit in Brussels (VUB) in 2013. From 2005 until 2017 he was working as an ESD researcher at imec in Leuven/Belgium. From March 2017 until June 2019 he was a program manager in the imec academy and in imec’s process technology transfer activities. Since July 2019 he has been with Infineon Technologies in Munich/Germany where he is a Principal Engineer ESD Development. His daily work focuses on component- and system-level ESD protection design for several RF and sensor product lines at Infineon. Since 2007 he has been an active member of different working groups in the ESDA standards committee, currently co-chairing WG 5.6 (Human Metal Model). He was the management chair of the IEW 2018 in Belgium. Since 2019 he has been a member of the steering committee of the EOS/ESD Symposium. In this function, he is the Technical Program Committee (TPC) chair of the EOS/ESD Symposium 2023. For the 2017-2019 term and again for the 2022-2024 term he has been an elected member of the ESDA Board of Directors. Since 2017 he is a business unit manager of the Advanced Topics committee of the ESDA. He has authored/co-authored more than 100 publications, tutorials, and patents in the field of ESD design and testing. He is co-author of the 2014 Springer book System-Level ESD Protection. He is a regular reviewer for several IEEE journals and a current member of the IRPS sub-committee on ESD and Latchup.

From This Author

The ESD Association Technology Roadmap

The ESDA technology roadmap is written to support and guide the daily work of ESD and latch-up experts in the worldwide industry and academia.

ESD Challenges in 2.5D/3D Integration

2.5D/3D integration is an Integrated Circuit (IC) packaging technique that allows the combination of dies of the same or different technologies in the same IC package.

The Many Aspects of Semiconductor Reliability with Impact on ESD Design

Reliability issues need to be continuously addressed during technology development as technologies further advance into novel transistor structures such as FinFETs and Multi-gate devices.

Digital Sponsors

Become a Sponsor

Discover new products, review technical whitepapers, read the latest compliance news, trending engineering news, and weekly recall alerts.

Get our email updates

What's New

- From Our Sponsors -

Sign up for the In Compliance Email Newsletter

Discover new products, review technical whitepapers, read the latest compliance news, trending engineering news, and weekly recall alerts.