Kathleen Muhonen

Small form factor devices often fail traditional field‑induced CDM testing, prompting the need for contact‑first methods. This article compares CC‑TLP, low‑impedance contact CDM, and relay‑based CDM techniques, outlining how each provides more repeatable, lower‑noise stress conditions for bare die and wafer‑level testing.

This column explores two air‑discharge‑based methods for testing small form factor products under the Charged Device Model. It examines limitations of traditional FICDM testers, presents wafer‑level and bare‑die testing approaches, and introduces contact‑first CDM techniques designed to improve reliability for fine‑pitch and low‑voltage devices.

FICDM testing wasn't designed for today's tiny chiplets and flip chip assemblies. Part 1 explores critical challenges: probes too large for microbumps, unreliable air discharge below 250V, and the mounting dilemma for bare die products.

This article explores the waveform specifications called out in the IEC 61000-4-2 standard.

This article highlights key concepts to designing electrostatic discharge (ESD) protection circuits for radio frequency (RF) and millimeter wave applications. Needed RF concepts are discussed and some popular protection schemes are illustrated.