Nick Koeller is an EMC Engineer at E3 Compliance which specializes in EMC & SIPI design, simulation, pre-compliance testing and diagnostics. He received his B.S.E in Electrical Engineering from Grand Valley State University and is currently pursuing his M.S.E in Electrical and Computer Engineering at GVSU. Nick participates in the industrial collaboration with GVSU at the EMC Center.
This is the 10th and the final article in a series of articles devoted to the design, test, and EMC emissions evaluation of 1- and 2-layer PCBs that contain AC/DC and/or DC/DC converters and employ different ground techniques.
We continue to focus on the AC/DC power converter board (2-layer PCB). We evaluate the implementation of several EMC countermeasures and present the conducted and radiated emissions results performed according to the CFR Title 47, Part 15, Subpart B, Class B.
This is the eighth article in a series of articles devoted to the design, test, and EMC emissions evaluation of 1- and 2-layer PCBs that contain AC/DC and/or DC/DC converters and employ different ground techniques [1-7].
This is the seventh column in a series devoted to the design, test, and EMC emissions evaluation of 1- and 2-layer PCBs that contain AC/DC and/or DC/DC converters, and employ different ground techniques .
This is the fifth article in a series of articles devoted to the design, test, and EMC emissions evaluation of 1- and 2-layer PCBs that contain AC/DC and/or DC/DC converters, and employ different ground techniques.
This is the fourth article in a series of articles devoted to the design, test, and EMC emissions evaluation of 1- and 2-layer PCBs that contain AC/DC and/or DC/DC converters, and employ different ground techniques.
This is the third article in a series of articles devoted to the design, test, and EMC emissions evaluation of 1- and 2-layer PCBs that contain AC/DC and/or DC/DC converters, and employ different ground techniques.
This is the second in a series of articles devoted to the design, test, and EMC emissions evaluation of 1- and 2-layer PCBs that contain AC/DC and/or
DC/DC converters and employ different ground techniques.