Get our free email newsletter

Bogdan Adamczyk

Dr. Bogdan Adamczyk is professor and director of the EMC Center at Grand Valley State University (http://www.gvsu.edu/emccenter) where he performs EMC educational research and regularly teaches EM/EMC courses and EMC certificate courses for industry. He is an iNARTE-certified EMC Master Design Engineer. He is the author of two textbooks, “Foundations of Electromagnetic Compatibility with Practical Applications” (Wiley, 2017) and “Principles of Electromagnetic Compatibility: Laboratory Exercises and Lectures” (Wiley, 2024). He has been writing “EMC Concepts Explained” since January 2017.

From This Author

Evaluation of PCB Design Options on Analog Signal RF Immunity using a Multilayer PCB

This month’s column is the last of three parts devoted to designing, testing, and EMC immunity evaluation of multilayer PCBs containing analog circuitry.

Evaluation of PCB Design Options on Analog Signal RF Immunity using a Multilayer PCB

This is the second of three articles devoted to the design, test, and EMC immunity evaluation of multilayer PCBs containing analog circuitry.

Evaluation of PCB Design Options on Analog Signal RF Immunity Using a Multilayer PCB

This is the first of three articles devoted to the design, test, and electromagnetic compatibility (EMC) immunity evaluation of multilayer PCBs containing analog circuitry. In this study, there are seven design variants that all contain a similar schematic but implement different PCB layout techniques.

Estimating the Parasitics of Passive Circuit Components

This article presents a simple method of estimating the parasitics of the three passive circuit components (R, L, C).

Evaluation of EMC Emissions and Ground Techniques on 1- and 2-layer PCBs with Power Converters

This is the 10th and the final article in a series of articles devoted to the design, test, and EMC emissions evaluation of 1- and 2-layer PCBs that contain AC/DC and/or DC/DC converters and employ different ground techniques.
- From Our Sponsors -

Evaluation of EMC Emissions and Ground Techniques on 1- and 2-layer PCBs with Power Converters

We continue to focus on the AC/DC power converter board (2-layer PCB). We evaluate the implementation of several EMC countermeasures and present the conducted and radiated emissions results performed according to the CFR Title 47, Part 15, Subpart B, Class B.

Evaluation of EMC Emissions and Ground Techniques on 1- and 2-layer PCBs with Power Converters

This is the eighth article in a series of articles devoted to the design, test, and EMC emissions evaluation of 1- and 2-layer PCBs that contain AC/DC and/or DC/DC converters and employ different ground techniques [1-7].

Evaluation of EMC Emissions and Ground Techniques on 1- and 2-layer PCBs with Power Converters

This is the seventh column in a series devoted to the design, test, and EMC emissions evaluation of 1- and 2-layer PCBs that contain AC/DC and/or DC/DC converters, and employ different ground techniques .

Evaluation of EMC Emissions and Ground Techniques on 1- and 2-layer PCBs with Power Converters

This article focuses on PCB layout considerations and the design of the reference return paths for the one- and two-layer boards.

Evaluation of EMC Emissions and Ground Techniques on 1- and 2-layer PCBs with Power Converters

This is the fifth article in a series of articles devoted to the design, test, and EMC emissions evaluation of 1- and 2-layer PCBs that contain AC/DC and/or DC/DC converters, and employ different ground techniques.
- From Our Sponsors -

Digital Sponsors

Become a Sponsor

Discover new products, review technical whitepapers, read the latest compliance news, trending engineering news, and weekly recall alerts.

Get our email updates

What's New

- From Our Sponsors -

Sign up for the In Compliance Email Newsletter

Discover new products, review technical whitepapers, read the latest compliance news, trending engineering news, and weekly recall alerts.