Allyson Telck

Allyson Telck is participating in a combined degree program to earn a Bachelor of Science in Electrical Engineering and a Master of Science in Biomedical Engineering at Grand Valley State University. She recently completed her final rotation as an Electromagnetic Compatibility Engineering co-op student at E3 Compliance, which specializes in EMC and high-speed design, pre-compliance testing, and diagnostics.

From This Author

EMC Concepts Explained

Impact of PCB Via and Trace Geometry on the Effectiveness of Decoupling Capacitors, Part 1

Explore how PCB via and trace geometry influence the real‑world effectiveness of decoupling capacitors. This first article in the series defines six board variants, capacitor placement strategies, and PCB topologies, setting the stage for upcoming RF emission results based on CISPR 25 testing.

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