Aries Electronics has announced its latest addition to its socket spring probe repertoire with new probes capable of contacting devices on 0.2mm pitch. These new probes enable socketing (for test and burn-in applications) for many new device packages and bare-die being designed and made on this pitch. The contact and spring material are gold plated beryllium-copper. The probes are available with either a pointed –tip of crown-shaped termination.
These new probes will yield >100k cycles over a temperature range of -55° to +150°C.. This performance makes these probes ideal for socketing for bench test or burn-in applications. In addition, these probes yield a very low inductance (~0.59nH) signal path making them compatible with testing RF devices at 10 GHz and beyond. They require about 6g of compression to actuate and can be placed on a .004” diameter PCB pad.
For more detailed specifications, visit http://www.arieselec.com/products/overview-csp-bga-sockets.htm.
