Amphenol Industrial Global Operations has enhanced its RADSOK technology high current contact system to RADSOK R4. This improved system is available in board-to-board, wire-to-board and busbar-to-board configurations.
Ideal for use by both server and board manufacturers, RADSOK R4 delivers connections up to 200A. The system’s hyperbolic grid contact provides multiple points of contact and a high contact surface area for efficient and low resistance power transmission.
RADSOK R4 features a lower temperature rise than other traditional contact systems in its class, enabling smaller overall connector packaging and compact footprints. With a 25% reduction in outside diameter over previous models, the new R4 helps to further increase power density and save space.
For more information, please visit http://www.amphenol-industrial.com or e-mail jgriffiths@amphenol-aio.com.