Transverse Electromagnetic Cell [TEM]

The history and insight into how the EMC specifications and procedures evolved at one automotive original equipment manufacturer (OEM). Other present-day OEM specifications are more similar than different mostly due to the extensive reference to international standards which these OEMs have taken part in developing (e.g., EMC committees). Knowing this history should help today’s EMC practitioners, especially those new to the discipline, gain some insight into the implementation and limitations of test procedures and when to be flexible in analyzing test results.

Several new transistor architectures have been proposed to achieve more powerful computing capability. In this article, we will look at the impacts of these transistor architectures on ESD reliability.

EMC testing laboratories often have limitations (limited availability, lead times, etc.) that can make it difficult to obtain timely results from routine troubleshooting. Inexpensive test equipment can support efficient and economical in-house EMC troubleshooting.

CISPR Publications 24 and 35 allow radiated and conducted immunity tests to be performed using I% or 4% steps. This article looks at measured radiated immunity test data to determine the typical shapes of radiated susceptibilities for multimedia equipment. The authors consider what those shapes tell us about the validity of the 4% step method.

Bias tees are an important tool for many applications including vector network analysis. As accurate understanding and modeling of power electronic components becomes increasingly important for the study of their electromagnetic emissions, so do broadband measurements with bias tees. This paper describes the composition of such a special bias tee in terms of the necessary geometries and circuitry.