Get our free email newsletter

New Fuijpoly Gap Filler Pad Exhibits Thermal Resistance of Only .21°Cin2/W

Fujipoly has introduced their new Sarcon GR25A-0H2-30GY, a 0.3mm thick, low thermal resistance interface material with a low-tac surface on both sides. This special treatment dramatically reduces material tearing and damage during assembly and rework operations. The new formulation improves cooling performance by filling unwanted air gaps between board components and processors thereby increasing surface contact with a heatsink.

Sarcon® GR25A-0H2-30GY transfers heat with a thermal conductivity of 2.8 W/m°K per ASTM D2326 and a thermal resistance of .21°Cin2/W at 14.5 PSI (1.33°Ccm2/W at 100Kpa).  This flame retardant TIM is available in sheets up to 300mm x 200mm and can be die-cut or trimmed to fit your exact application specifications.

For more information, call (732) 969-0100 or visit us on the Web at www.fujipoly.com.

- Partner Content -

How To Work Safely with High‑Voltage Test & Measurement Equipment

This white paper describes an alternative approach to calibrating high-voltage systems and provides meter and probe safety considerations and general guidance for safely operating high-voltage equipment.

Related Articles

Digital Sponsors

Become a Sponsor

Discover new products, review technical whitepapers, read the latest compliance news, trending engineering news, and weekly recall alerts.

Get our email updates

What's New

- From Our Sponsors -

Sign up for the In Compliance Email Newsletter

Discover new products, review technical whitepapers, read the latest compliance news, trending engineering news, and weekly recall alerts.