[symple_highlight color=”yellow”]Abstract Submission Deadline Nov. 20, 2015[/symple_highlight]
Located on the shores of Lake Starnberg, 30 kilometers Southwest of Munich, lies the Tutzing estate and its 18th century mansion. It has been chosen as the venue of our workshop with its modern conference rooms and facilities. The spirit of this place encourages thoughtful discussions and intensive interaction.
The IEW will include invited seminars, technical sessions, special interest groups (SIGs), discussion groups, and invited speakers. The IEW especially invites submission of late-breaking exciting new research to stimulate discussion and interaction around new ideas, encouraging new research topics. To maintain the unique IEW experience and provide ample opportunity for informal discussions, the 2016 IEW workshop presentation format for Technical sessions will begin with each author presenting a brief summary to highlight key findings, followed by an interactive poster-based discussion session among authors and attendees. The IEW is closely aligned with the EOS/ESD Symposium for collaborative conference activities.
Two special attention focus issues for IEW 2016 include:
Automotive Applications EOS/ESD/EMC
The electronic content of automobiles is increasing, leading to more complex electronic modules and increasing complexity of meeting integration and reliability requirements for Integrated Circuits. The IEW invites contributions that address EOS, ESD and EMC challenges in automotive IC design, including complying with standards such as Bulk Current Injection (BCI), Direct Power Injection (DPI), IEC-61000-4-2 and ISO-10605.
ESD Co-Design—Trade-offs between Requirements for IC Operation, Component-level ESD, System-level ESD, EOS Sensitivity
Often, the complexity of an ESD design is increased by the trade-offs required to avoid interfering with other design requirements. The IEW invites contributions that highlight particularly challenging requirements, unique/novel solutions to meeting those requirements or unexpected interactions between an ESD implementation and another design requirement.
Areas the IEW would also like you to consider as abstract submission topics include:
- Anomalous/Unresolved ESD Issues
- EDA EOS/ESD Tools Best Practices and Experiences
- System-Level ESD/EOS Issues
- Failure Analysis Techniques
- Technology Integration Issues
- Novel On-Chip Protection Clamps and
- Circuit Configurations
- ESD Test Characterization, Methods, &
- Issues
Submission Instructions
In keeping with the informal character of this workshop, please prepare your abstract in the form of a short powerpoint presentation. After the title slide, the second slide of the presentation should describe the objective and significance in a 200 word summary. The presentation should not exceed 5 additional slides; with representative data and figures that will be the foundation for the poster you plan to present at the workshop. Please save your presentation abstract in pdf format and email including title, author affiliation, and e-mail address to iew@esda.org no later than November 20, 2015.
The submission format is a PDF® file (Adobe Acrobat®). Notification of acceptance will occur by December 16, 2015. Final, full presentations for the workshop in MS PowerPoint® format must be received by April 15, 2016. There will be no published proceedings of the workshop. For any questions please contact the Technical Program Chair, Hans Kunz (hkunz@ti.com).
The IEW encourages student submissions by providing a 50% discount in registration fees for a limited number of student presenters. Proof of student status must be submitted along with the abstract for the workshop presentation.
Find more information at: https://www.esda.org/events/iew/
